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Plasma CVD Equipment Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Plasma CVD Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. ジャパンクリエイト Saitama//Testing, Analysis and Measurement
  3. SCREENファインテックソリューションズ Kyoto//Industrial Machinery
  4. プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  5. ケニックス Hyogo//Electronic Components and Semiconductors
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Plasma CVD Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Plasma CVD equipment for thick film formation of SiO2 サムコ
  2. [Data] Silicon processing data using the non-bosch process サムコ
  3. Plasma CVD equipment "SHUTTLELINE(R) Series" プラズマ・サーモ・ジャパン
  4. The ideal small plasma CVD device for research and prototyping: 'VC-R400G' SCREENファインテックソリューションズ
  5. Plasma CVD equipment サムコ

Plasma CVD Equipment Product List

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Plasma CVD equipment for thick film formation of SiO2

Plasma CVD equipment for thick film formation of SiO2

Plasma CVD device for thick film formation. High speed and low stress (patent pending).

● The adoption of a unique self-bias method enables high-speed (3000-5000 Å/min) and low-stress film deposition. (Patent pending) ● Low-temperature film deposition is possible at room temperature to about 350°C. Additionally, film deposition on plastics is feasible. ● Unique modifications in the reaction chamber help suppress particle generation. ● The LS-CVD method using liquid source TEOS allows for excellent step coverage and filling effects in film deposition. ● Arbitrary control of the refractive index is possible using liquid sources of Ge, P, and B. In addition to the standard one series, it is possible to add two more series of dopant introduction systems as options.

  • CVD Equipment

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Plasma CVD equipment

Plasma CVD equipment

Plasma CVD equipment

● Despite its compact design, it can accommodate 5 pieces of 3-inch wafers, 3 pieces of 4-inch wafers, and 1 piece of 8-inch wafers. ● Up to 100-step processes are possible. ● Equipped with a load lock chamber, enabling stable processes. ● Features an interlock mechanism for various safety measures.

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[Data] Silicon processing data using the non-bosch process

[Data] Silicon processing data using the non-bosch process

We are publishing new data on the non-bosch process for silicon.

This document introduces silicon processing data using the non-Bosch process. It includes results of silicon etching processed with the non-Bosch process using the RIE-800iP. Please take a moment to read it. 【Contents】 ■ Process ■ High aspect ratio Bosch process results ■ Sequential taper shape processing results ■ SEM results of silicon sidewall observation *For more details, please refer to the PDF document or feel free to contact us.

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[Data] - Example of ICP Etching Process for MicroLEDs

[Data] - Example of ICP Etching Process for MicroLEDs

As a result of GaN microLED mesa processing, we have published emission spectral data during the GaN microLED mesa processing!

This document introduces examples of ICP etching for microLEDs. As part of the experiments and results, it includes the outcomes of GaN microLED mesa processing and the photoluminescence spectral data during the GaN microLED mesa processing. Please take a moment to read it. 【Contents】 ■ Experiments and Results ■ Results of GaN MicroLED Mesa Processing ■ Photoluminescence Spectral Data During GaN MicroLED Mesa Processing ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

  • CVD Equipment

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Plasma CVD device for PET bottles

Plasma CVD device for PET bottles

Coating is possible up to a 3L container! It contributes to reducing logistics costs through lightweight containers.

This product is a film deposition device specialized for DLC coating on "PET bottles," which are commonly used as resin container materials, utilizing the plasma CVD process technology that our company excels in. By applying a sub-micron order DLC thin film coating to the inner surface of PET bottles, it contributes to preventing flavor deterioration due to oxidation of the contents, preventing the leaching of carbonated components, and reducing logistics costs through container weight reduction. 【Features】 - Various equipment configurations can be proposed based on the required production quantity. - Coating is possible for containers up to 3L. - Please consult us regarding containers larger than 3L. - Please consult us regarding resin materials other than PET. - Please consult us regarding metal materials. *For more details, please refer to the PDF document or feel free to contact us.

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Plasma CVD Equipment Concept-150/200

Plasma CVD Equipment Concept-150/200

With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.

This device is compatible with 4, 5, 6, and 8-inch wafers and is designed to form silicon oxide and silicon nitride films on the wafers using the plasma CVD method. The basic configuration consists of three modules: a process module, an RF generator module (one set each for high frequency and low frequency), and a vacuum pump module.

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Liquid Source Plasma CVD Equipment

Liquid Source Plasma CVD Equipment

A compact and space-efficient device! The substrate supports φ4 inch, and it comes with a heating mechanism and T/S variable mechanism!

This product is a plasma CVD device with a cylinder cabinet designed for liquid raw material sources, including TEOS. It is equipped with a bakeable MFC compatible with liquid sources and various baking mechanisms, and features a uniquely designed plasma electrode to prevent internal abnormal discharges and ensure stable plasma generation. The device allows for substrate replacement and internal maintenance through the opening and closing of the top cover, and it is compact with excellent space efficiency. 【Features】 ■ Equipped with a cylinder cabinet ■ Includes a bakeable MFC compatible with liquid sources and various baking mechanisms ■ Designed with a unique plasma electrode ■ Allows for substrate replacement and internal maintenance through the opening and closing of the top cover ■ Compact and space-efficient *For more details, please refer to the PDF materials or feel free to contact us.

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Plasma CVD device "PEGASUS"

Plasma CVD device "PEGASUS"

Low-temperature film formation. High insulation, high barrier, uniformity!

"PEGASUS" is a mass production-compatible plasma CVD device that enables the formation process of insulating films and protective films for memory, power devices, and MEMS with precise and stable film deposition at low temperatures. It features a high level of safety due to its interlock mechanism and prevents contamination from the backside by using non-metal materials at the wafer contact points. 【Features】 ■ Low-temperature film deposition ■ Maintenance-friendly ■ Wafer handling ■ Footprint ■ Maintenance support, etc. *For more details, please download the PDF or feel free to contact us.

  • Plasma surface treatment equipment

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Plasma CVD device for three-dimensional object experiments (DLC, amorphous SiC)

Plasma CVD device for three-dimensional object experiments (DLC, amorphous SiC)

The compatible film types are DLC, amorphous SiC, etc.! Equipped with a substrate heating mechanism (maximum set temperature: 500°C).

We would like to introduce our "Plasma CVD System for 3D Objects" that we handle. This system can deposit films on three-dimensional objects, and compatible film types include DLC and amorphous SiC, among others. It operates via PC control (sequencer control), allowing for fully automated operation and data logging. We design and manufacture equipment tailored to our customers' needs and budgets, from experimental devices to production systems. Please feel free to contact us for inquiries. 【Features】 ■ Experimental plasma CVD system capable of depositing films on three-dimensional objects ■ Compatible film types: DLC, amorphous SiC, etc. ■ Equipped with a substrate heating mechanism (maximum set temperature: 500°C) ■ Fully automated operation and data logging via PC control (sequencer control) *For more details, please refer to the PDF document or feel free to contact us.

  • Plasma Generator
  • CVD Equipment

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[Manufacturing Results] Plasma CVD Equipment for 3D Object Experimentation

[Manufacturing Results] Plasma CVD Equipment for 3D Object Experimentation

Introduced in the surface treatment process! The material of the vacuum chamber is made of stainless steel, with examples of products achieving a vacuum level of less than 1 Pa.

We would like to introduce our achievements in manufacturing a "Plasma CVD system for three-dimensional objects" for the automotive and motorcycle parts manufacturing industry. We have introduced a product equipped with a substrate heating mechanism that allows for the deposition of DLC, amorphous SiC, and other materials on three-dimensional objects (maximum set temperature: 500°C). Additionally, it features PC operation (sequencer control) for fully automated data logging. Please feel free to contact us when you need assistance. 【Overview of Achievements】 ■ Experimental plasma CVD system capable of film deposition on three-dimensional objects ■ Compatible film types: DLC, amorphous SiC, etc. ■ Equipped with a substrate heating mechanism (maximum set temperature: 500°C) ■ Fully automated and data logging via PC operation (sequencer control) *For more details, please refer to the related links or feel free to contact us.

  • Vacuum Equipment

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Plasma CVD equipment "SHUTTLELINE(R) Series"

Plasma CVD equipment "SHUTTLELINE(R) Series"

Compact and versatile! This is a high-performance device that can also be adapted for device evaluation processes.

The "SHUTTLELINE(R) series" is a flexible semiconductor manufacturing device that supports PECVD and dry etching for thin film deposition and failure analysis processes. It is compatible with RIE/ICP-RIE and PECVD/ICP-CVD, and is a compact device that can be used for various applications with a range of options. It is recommended for companies and academia that need a compact lab-scale device for R&D or laboratories, or for those looking for a device that can perform both film deposition and etching in one unit. 【Features】 ■ High-precision, damage-free etching process ■ Supports various wafer sizes and shapes, including dies, packaged dies, wafer pieces, and full wafers ■ The shuttle system eliminates the need for hardware changes for different sample sizes ■ Multi-functional support for film deposition/etching in one unit ■ Proven adoption worldwide, with local support through Plasma-Therm LLC's global network *For more details, please feel free to contact us.

  • Other semiconductor manufacturing equipment

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Plasma CVD equipment

Plasma CVD equipment

Plasma CVD equipment

● Adopts a tray cassette system. 1. Achieves high throughput by reducing transport time. 2. Supports wafers from φ2 inches to φ8 inches by changing trays. ● Adopts a vacuum cassette chamber. 1. Achieves high throughput with a single vacuum exhaust per cassette. 2. Avoids contamination effects and prevents oxidation of the wafer surface. ● Further improves the reliability of the PD-220L reaction chamber, which has a rich track record of deliveries.

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Plasma CVD equipment 'PD-270STLC / PD-2201LC'

Plasma CVD equipment 'PD-270STLC / PD-2201LC'

Tensile and compressive stress control is possible! It can be flexibly installed to fit the space.

At Samco, Inc., we handle the plasma CVD equipment 'PD-270STLC/PD-2201LC'. The 'PD-270STLC' allows for excellent coverage during film formation at the top, middle, and bottom. Additionally, the 'PD-2201LC' can accommodate a wide range of customer requests, from simultaneous film formation of multiple small-diameter wafers using tray transport to highly uniform film formation through single wafer processing. 【Features】 <PD-270STLC> ■ SiN film formation using liquid precursor SN2 ■ Excellent coverage during film formation at the top, middle, and bottom *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment

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Oxide/Nitride Plasma CVD Equipment

Oxide/Nitride Plasma CVD Equipment

Controllable extensive membrane properties! Significant particle reduction and improved productivity.

The "Oxide/Nitride Plasma CVD Equipment" achieves low stress, high hardness, and high insulation through a dual-frequency independent application method. Significant particle reduction and improved productivity are achieved through a radical plasma cleaning system. We can also manufacture multi-chamber specifications and various custom designs, so please feel free to contact us when needed. 【Features】 ■ Achieves low stress, high hardness, and high insulation through a dual-frequency independent application method ■ Excellent film thickness distribution and reproducibility ■ Reduction of metal contamination through special surface treatment ■ Control of a wide range of film properties ■ Abundant accumulated data *For more details, please refer to the PDF document or feel free to contact us.

  • CVD Equipment

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Plasma CVD device for three-dimensional objects

Plasma CVD device for three-dimensional objects

A simple structure with high versatility! It adopts a unique plasma control method.

The "Plasma CVD Equipment for Three-Dimensional Objects" has a wealth of accumulated data and employs a unique plasma control method. The chamber volume is 1m3. It features a simple structure with high versatility, capable of multi-stage bulk processing. We can also manufacture multi-chamber specifications and various custom orders, so please feel free to contact us when needed. 【Features】 ■ Chamber volume: 1m3 ■ Unique plasma control method ■ Capable of multi-stage bulk processing ■ Simple structure with high versatility ■ Can deposit films on various product materials *For more details, please refer to the PDF document or feel free to contact us.

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